Handheld Thickness Gauge
Hitachi - CMI760
Inspect copper foil layer, CCL sheets, surfaces, traces, and copper-plated holes all on a single device.
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Technical Description
The CMI760 thickness gauge can connect with various probes tailored to specific applications for measuring the copper layer thickness on PCB electronic circuit boards, including copper surfaces, copper-plated holes, and copper traces.
Using Micro-Resistance and Eddy Current measurement methods, it provides accurate, fast, and non-destructive results, unlike traditional methods. This approach saves time and ensures high reliability.
Applications
- Measure Surface Copper Thickness on PCB Boards
- Measure Through-Hole Copper Thickness
Specifications
| GAUGE SPECIFICATIONS | |
| Dimensions: | 29.21 (W) x 26.67 (D) x 13.97 (H). |
| Weight: | 6 lbs. (2.7 kg). |
| Unit: | Select from mils, µm, µin, mm, in., or % as units for display. |
| Display: | Large LCD 480 (H) x 32 (V) pixels, backlit, wide-angle view. |
| Statistical Display: | Readings, standard deviation, mean, high/low. |
| Charts: | Histogram, trend, x-Bar, and r-chart. |
| SRP-4 PROBE: | |
| Accuracy: | ±1% (±0.1 µm) referred to reference standard. |
| Precision: | 0.2% typical. |
| Electrodeposited Copper: | 0.3% typical. |
| Resolution: | 0.1 at > 10, 0.01 at < 10, 0.001 at <1. |
| ETP PROBE SPECIFICATIONS: | |
| Accuracy: | ±0.01 mil (0.25 µm) < 1 mil (25 µm). |
| Precision: | 1.0% at 1.2 mil typical. |
| Resolution: | 0.01 mils (0.25 µm). |
| Eddy Current: | Conforms to method ASTM E376 |
| Thickness Range: | 0.08-4.0 mils (1 - 102 µm). |
| Minimum Hole Size: | 35 mils (899 µm). |
